Title: STUDY OF Sn-Ag-Cu ALLOY RELIABILITY THROUGH MATERIAL MICROSTRUCTURE EVOLUTION AND LASER MOIRE INTERFEROMETRY When: Monday, June 30, 2008 at 2:00 PM Where: MARC Building, Room 201

Title: Modeling, Design and Energy Management of Fuel Cell Systems for Aircraft When: Wednesday, July 2, 2008 at 10:00 AM Where: MRDC Building, Room 4211

Title: A Study of Flexible Fiber Suspensions using Lattice Boltzmann MEthod When: Wednesday, July 2, 2008 at 10:00 AM Where: IPST Building, Room 521

Title: Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices: Using Laser Ultrasound and Finite Element Method When: Tuesday, July 15, 2008 at 3:00 PM Where: MARC Building, Room 331

Title: Design and Fabrication of Free-Standing Structures as Off-Chip Interconnects for Microsystems Packaging When: Monday, July 28, 2008 at 10:00 AM Where: MARC Building, Room 401

Title: Dual-electrode Capacitive Micromachined Ultrasonic Transducers for Medical Ultrasound Applications When: Wednesday, July 30, 2008 at 10:00 AM Where: Love Building, Room 210

Title: Fluidic-driven Cooling of Electronic Hardware Part I: Channel Integrated Vibrating Reed Part II: Active Heat Sink When: Wednesday, July 30, 2008 at 11:00 AM Where: Love Building, Room 311

Title: Experimentally Validated Multiscale Thermal Modeling of Electronic Cabinets When: Friday, August 8, 2008 at 10:00 AM Where: MRDC Building, Room 4211

Title: Numerical Investigation of Micro-Macro Coupling in Magneto-Impedance Sensors for Weak Field Measurments When: Monday, August 11, 2008 at 9:00 AM Where: MARC Building, Room 114

Title: Stability and controllability investigation of MREs in longitudinal vibration absorbers When: Thursday, August 14, 2008 at 1:30 PM Where: MRDC Building, Room 4211